Hanmi Semiconductor will hold an investor relations (IR) session for major overseas institutional investors and actively promote its future growth strategy.

According to a disclosure on the 22nd, Hanmi Semiconductor will participate in the '2026 CITIC CLSA Northeast Asia Forum' to be held in Seoul on the 23rd. At this event, sponsored by CLSA Securities, the company plans to hold one-on-one and group meetings with major overseas institutional investors.

The key topics that Hanmi Semiconductor will focus on during this IR are as follows: • Entry into the AI system semiconductor (foundry and OSAT) market • Launch of TC bonders (40 and 120) for 2.5D packaging • Supply of HBF (High Bandwidth Flash) TC bonders to customers • Strategy for entering the U.S. semiconductor market, including TeraFab

In particular, the company plans to emphasize the launch of its new-concept TC bonders in line with the explosively growing demand for AI memory semiconductors. In addition, it will provide a detailed introduction to its strategy for targeting the U.S. market in response to the demand for AI and aerospace packaging equipment.

In this regard, Hanmi Semiconductor stated, "The IR schedule may be subject to change at the company's discretion."