Hanmi Semiconductor announced on the 8th that it has signed a contract to supply SK Hynix with 'TC BONDER 4.5 GRIFFIN' equipment for manufacturing the next-generation semiconductor, HBM4.

The contract amount is 44.2 billion won (44,200,000,000 won), excluding Value-Added Tax (VAT). This accounts for 7.66% of Hanmi Semiconductor's consolidated sales of 57.668 billion won in 2025. The delivery region is domestic.

The contract date for the equipment supply is June 8, 2026, when the purchase order (P/O) is received, and the contract period runs from that date until September 2 of the same year.

Hanmi Semiconductor stated, "The contract end date (delivery date) may be changed subject to agreement with the customer."