Hanmi Semiconductor has unveiled a new advanced packaging product for AI semiconductors, launching an effort to target the global market. As of the afternoon of the 30th, Hanmi Semiconductor's stock price is trading at 260,000 won, up 2,000 won (0.78%) from the previous trading day, showing a slightly bullish trend.

On this day, Hanmi Semiconductor announced the launch of the '2.5D TC Bonder 40,' a new equipment for the 2.5D packaging process, which is essential for realizing the high performance and high bandwidth of AI semiconductors. This equipment utilizes Thermo Compression bonding technology, and the company plans to begin full-scale supply to global foundries and OSAT (Outsourced Semiconductor Assembly and Test) companies.

As the AI semiconductor market expands rapidly, the importance of advanced packaging technology is growing. The market expects that driven by increasing global demand for AI semiconductors, including from NVIDIA, the packaging equipment market necessary for expanding the production of HBM (High Bandwidth Memory) and AI accelerators will also grow in tandem.

Through the launch of this new product, Hanmi Semiconductor's strategy is to expand its advanced equipment portfolio centered on TC bonders to acquire global customers and proactively respond to the growth of the AI semiconductor ecosystem. However, the timing of performance improvement driven by the expanded supply of the new equipment is likely to be influenced by major customers' investment schedules and the overall growth rate of the AI semiconductor market.

[This article was written with the assistance of AI. This article is not intended to solicit investment, and the final judgment and responsibility for investments lie with the investor.]