Hanmi Semiconductor has disclosed a corporate value enhancement plan centered on its mid-to-long-term growth strategy and enhanced shareholder returns. The launch of next-generation semiconductor packaging equipment and expansion into the U.S. market serve as the core pillars.

On the 20th, Hanmi Semiconductor presented a comprehensive roadmap through its '2026 Hanmi Semiconductor Corporate Value Enhancement Plan,' which includes the company overview, financial status and soundness, industry analysis, new product launches, responsible management and dividends, mid-to-long-term growth strategy, and implementation status.

■ New Product and Technology Strategy The company presented its new product direction, including the 'BOC COB BONDER,' essential for the production of stacked GDDR and stacked NAND flash, and the '2.5D TC BONDER,' aimed at entering the 2.5D package market for AI system semiconductors. Additionally, the company disclosed its HBM TC bonder roadmap, with plans to release a prototype of the 2nd-generation hybrid bonder by the end of 2026 and operate a hybrid bonder factory in the first half of 2027. The company also plans to launch a wide TC bonder in response to discussions on relaxing the JEDEC HBM package height standards.

■ U.S. Market Expansion As part of its implementation plan, the company aims to establish a U.S. subsidiary in the second half of 2026, targeting entry into the U.S. AI semiconductor market, including Therabat. Through this initiative, the company intends to drive future sales growth and proactively respond to equipment supply shortages.

■ Shareholder Returns and Corporate Governance In terms of improving corporate governance, the company plans to double its core compliance rate for the Corporate Governance Report compared to the previous year and implement tax-free dividends for the fiscal year 2025. The company disclosed that it qualifies as a high-dividend company under the Special Tax Treatment Control Act.

The dividend payout ratio for the fiscal year 2025 is 35.5%, with dividend income amounting to 75.88 billion won, an 11.1% increase from the previous year's 68.29 billion won.

However, the company added that this plan contains forward-looking information, meaning the plan may be modified or actual results may differ depending on future market conditions and changes in the business environment.