[Breaking] Techwing Signs 10.7 Billion Won Contract to Supply Semiconductor Test Equipment to Micron Malaysia
Techwing announced on the 20th via a regulatory filing that it has signed a contract to supply semiconductor test equipment to Micron Memory Malaysia SDN. BHD.
![[Breaking] Techwing Signs 10.7 Billion Won Contract to Supply Semiconductor Test Equipment to Micron Malaysia](https://media.cbcglobe.com/tenants/cbc00000-0000-4000-8000-000000000001/media/cbc/2026/06/581748/ed2a73c31f2e2200/variants/hero.webp)
Techwing announced on the 20th via a regulatory filing that it has signed a contract to supply semiconductor test equipment to Micron Memory Malaysia SDN. BHD.
- ■ Contract Overview
- Counterparty: Memory semiconductor manufacturer and seller Micron Memory Malaysia SDN. BHD.
- Supply region: Malaysia
- Contract amount: 10,668,099,000 won (USD 7,215,000)
- Proportion of revenue: 6.70% of recent revenue (1,591,283,984,020 won on a consolidated basis for 2025)
- ■ Delivery and Payment Terms
- Contract period: November 3, 2026 – January 17, 2027
- Delivery schedule: Partial deliveries to begin on November 3, 2026, with final delivery scheduled to be completed on November 17 of the same year
- Products will be supplied sequentially until the contract end date
- Payment: 90% within 60 days after shipment, 10% within 60 days after approval
■ Exchange Rate and Other Notes The won-equivalent amount was calculated using the Hana Bank exchange rate (1 USD = 1,478.60 KRW) as of July 16, 2026. The company also noted that the supply period and supply price may change at the customer's request.
© 2026 CBC Globe. All rights reserved. Unauthorized reproduction, redistribution, or republication of this content in whole or in part is prohibited.
Oseong Kwon
Staff Reporter
CBC Globe publishes verified stories with editorial review, source checks, and tenant-specific publication standards.



