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[Breaking] Techwing Signs 10.7 Billion Won Contract to Supply Semiconductor Test Equipment to Micron Malaysia

Techwing announced on the 20th via a regulatory filing that it has signed a contract to supply semiconductor test equipment to Micron Memory Malaysia SDN. BHD.

Oseong Kwon
Staff Reporter
2 min read
[Breaking] Techwing Signs 10.7 Billion Won Contract to Supply Semiconductor Test Equipment to Micron Malaysia
CBC News

Techwing announced on the 20th via a regulatory filing that it has signed a contract to supply semiconductor test equipment to Micron Memory Malaysia SDN. BHD.

  • ■ Contract Overview
  • Counterparty: Memory semiconductor manufacturer and seller Micron Memory Malaysia SDN. BHD.
  • Supply region: Malaysia
  • Contract amount: 10,668,099,000 won (USD 7,215,000)
  • Proportion of revenue: 6.70% of recent revenue (1,591,283,984,020 won on a consolidated basis for 2025)
  • ■ Delivery and Payment Terms
  • Contract period: November 3, 2026 – January 17, 2027
  • Delivery schedule: Partial deliveries to begin on November 3, 2026, with final delivery scheduled to be completed on November 17 of the same year
  • Products will be supplied sequentially until the contract end date
  • Payment: 90% within 60 days after shipment, 10% within 60 days after approval

■ Exchange Rate and Other Notes The won-equivalent amount was calculated using the Hana Bank exchange rate (1 USD = 1,478.60 KRW) as of July 16, 2026. The company also noted that the supply period and supply price may change at the customer's request.

Oseong Kwon
Staff Reporter

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